Recap of Visit to ASTRI on 27 Aug 2026

Science and research converge to empower innovation, and technological breakthroughs drive future growth. Led by Mr Alvin Lee Wai Yip, Chairman of The Hong Kong Electronics & Technologies Association (HKETA), a delegation visited the Hong Kong Applied Science and Technology Research Institute (ASTRI). The visit brought together industry insights and top‑tier research expertise, igniting sparks of innovative thinking.

The delegation was warmly received by Dr. Wong Ying, Chief Technology Officer of ASTRI, together with his research team. Both sides held in‑depth discussions on a wide spectrum of frontier technologies, including Agent‑based Artificial Intelligence, Vision‑Language Models, semiconductor defect inspection, 5G Time‑Sensitive Networking (TSN) for smart manufacturing, and immersive cooling solutions. They exchanged views on research breakthroughs, real‑world application scenarios, technical challenges and pathways for commercialisation, exploring new industrial opportunities amid technological transformation.

During the visit, the delegation toured ASTRI’s Materials Characterisation Centre and experienced a live demonstration of the pressure‑sensing pad technology. This achievement stands as a tangible fruit of joint collaboration between HKETA and ASTRI, vividly illustrating how research outcomes can be translated into practical industrial solutions.

This visit goes beyond a simple exchange of views. It further strengthens the industry‑research partnership, laying a solid foundation for future technology transfer and commercialisation of research outputs.

Looking ahead, HKETA will keep bridging industry and research communities. Working hand‑in‑hand with ASTRI and other partners, we will bring more innovative technologies out of laboratories and power industrial upgrading, injecting continuous momentum into Hong Kong’s vibrant innovation and technology ecosystem.

HKETA代表團到訪應科院 聚焦尖端技術合作

科研匯聚力量，創新驅動未來。香港電子科技商會（HKETA）主席李偉業先生（Alvin Lee Wai Yip）率領代表團，走訪香港應用科技研究院（應科院），以產業視角對接頂尖科研力量，碰撞創新的思想火花。

代表團獲應科院首席科技官黃莹博士及其科研團隊熱情接待。雙方圍繞代理式人工智能、視覺語言模型、半導體瑕疵檢測、智慧製造5G時間敏感網絡（TSN）、沉浸式冷卻方案等多項前沿技術展開深度交流。從技術研發突破到產業落地場景，從技術難點攻關到商業化路徑探索，雙方暢所欲言，共謀技術變革下的產業新機遇。

參訪行程中，代表團參觀應科院材料表徵中心，親身體驗壓力感應墊技術示範。這項成果正是HKETA與應科院攜手協作的豐碩結晶，生動演繹科研成果走進產業的真實力量。

這次會面，不僅是一次交流訪問，更是產研夥伴關係的再度深化，為後續技術轉移、科研成果商業化落地奠下良好基礎。

展望前路，HKETA將持續聯結產業與科研界，與應科院等各界夥伴同心同行，讓更多創新技術走出實驗室，賦能產業升級，共同為香港創科生態注入源源不絕的發展動能。