Event Recap

Organized by the Hong Kong Electronics & Technologies Association (HKETA) and the Hong Kong Trade Development Council (HKTDC), the Symposium on Innovation & Technology 2026 was successfully held on October 13, 2026, at Theatre 2 of the Hong Kong Convention & Exhibition Centre.

Centered around the theme “AI-Driven Security & The Next-Gen Infrastructure”, the Symposium drew strong attendance from industry leaders, technology innovators, and business professionals. We were deeply honored to have Mr. Cheung Yee Wai, Daniel, JP, Acting Commissioner, Digital Policy Office, the HKSARG, as our Guest of Honour to deliver the opening address and officially launch the event.

Insights from Industry Visionaries

The Symposium featured distinguished speakers who delivered insightful presentations on the critical interplay between AI and digital infrastructure:

• Mr. Alexander Gerfer (Chief Technology Officer, Würth Elektronik eiSos) shared insights on “Powering the AI Future: The Electronics Behind Intelligent Systems”.
• Dr. Charles Cheung (Adjunct Associate Professor, Department of Mathematics, Hong Kong Baptist University) presented “Scaling the Agentic AI Era: From Token Infrastructure to Business and Scientific Breakthroughs”.
• Ms. Silvia Ihensekhien (Chief Security Advisor, Greater China, Microsoft) addressed “Protecting the AI Future: Building Secure, Trusted and Resilient Enterprises”.

Panel Discussion: Building Resilience in the AI Era

Moderated by Dr. Paulina Chan, Honorary Secretary of HKETA, the panel discussion explored the future of AI and cyber resilience. Panelists highlighted that robust cybersecurity and data governance serve as crucial business enablers that foster trust and empower enterprises to innovate with confidence.

Acknowledgements

HKETA and HKTDC extend our heartfelt gratitude to our Guest of Honour, speakers, sponsors, supporting organizations, and all participants for making the Symposium a resounding success. We look forward to continuing our mission to drive technological excellence and industry collaboration.